| CIRCUITS (Design for manufacturing capability)-Rigid |
| Item | Name | limit capability(sample) | limit capability(small-medium volume) |
| 1 | Material | Normal FR-4 | Brand: KingBoard, ShengYi, ITEQ | Brand: KingBoard, ShengYi, ITEQ |
| 2 | Special material | Normal Tg, FR-4(HF), High Tg FR-4(HF), High Tg FR-4, PTFE, Ceramic | Normal Tg, FR-4(HF), High Tg FR-4(HF), High Tg FR-4, PTFE, Ceramic |
| 3 | Type | Rigid PCB | Multi-blind&Buried, thick copper, Via in Pad(copper filled, resin filled), Resin filled(not via in pad), Gold fingers without tie bar, hard gold plated, Edge plated. | Multi-blind&Buried, thick copper, Via in Pad(resin filled), Resin filled(not via in pad), Gold fingers without tie bar, hard gold plated, Edge plated. |
| 4 | Lay up | Blind&Buried | lamination≤3times | lamination≤2times |
| 5 | Surface
Finish | Lead-free | Lead-free with HASL,Electroplated gold(Substrate thickness≤2OZ),ENIG,Immersion Tin,Immersion Sliver,OSP,Hard Gold,ENIG+OSP,ENIG+Gold finger,Electroplated gold+Gold finger,Immersion Sliver+Gold finger,Immersion Tin+Gold finger,ENEPIG | Lead-free with HASL,Electroplated gold(Substrate thickness≤1OZ),ENIG,Immersion Tin,Immersion Sliver,OSP,Hard Gold,ENIG+OSP,ENIG+Gold finger,Electroplated gold+Gold finger,Immersion Sliver+Gold finger,Immersion Tin+Gold finger,ENEPIG |
| 6 | Leaded | Lead with HASL | Lead with HASL |
| 7 | Plating/coating
thickness | HASL | 2-40UM(0.4μm on large tin area of Leaded HASL, 1.5μm on large tin area of HASL lead free) | 2-40UM(0.4μm on large tin area of Leaded HASL, 1.5μm on large tin area of HASL lead free) |
| 8 | Electroplated gold | Ni:3-5UM;Au;0.025-0.1UM | Ni:3-5UM;Au;0.025-0.1UM |
| 9 | ENIG | Ni:3-5UM;Au;0.025-0.1UM | Ni:3-5UM;Au;0.025-0.1UM |
| 10 | Immersion Tin | ≥1.0UM | ≥1.0UM |
| 11 | Immersion Sliver | 0.1-0.3UM | 0.1-0.3UM |
| 12 | OSP | 0.2-0.3UM | 0.2-0.3UM |
| 13 | Hard Gold | ≤1.25UM | ≤1.25UM |
| 14 | ENEPIG | Ni:3-5UM;Pd:0.05-0.1UM;Au;0.025-0.1UM | Ni:3-5UM;Pd:0.05-0.1UM;Au;0.025-0.1UM |
| 15 | Carbon Ink | 0.1-0.35UM | 0.1-0.35UM |
| 16 | Soldermask | 15-25UM(on copper area),8-12UM(on via pad and on circuits around the corner)(just for one-time print and copper thickness<48um) | 15-25UM(on copper area),8-12UM(on via pad and on circuits around the corner)(just for one-time print and copper thickness<48um) |
| 17 | Peelable Soldermask | 0.2-0.5MM | 0.2-0.5MM |
| 18 | Hole | Finshed mechanical hole size | 0.10-6.2mm(corresponding drilling tool size is 0.15-6.3mm) | 0.15-6.2mm(corresponding drilling tool size is 0.2-6.3mm) |
| 19 | Min finished hole size for PTFE material and hybrid PCB is0.35mm(Corresponding drilling tool size is 0.45mm) | Min finished hole size for PTFE material and hybrid PCB is0.35mm(Corresponding drilling tool size is 0.45mm) |
| 20 | Max finished hole size for blind & buried via is not greater than 0.2mm(corresponding drilling tool size is not greater than 0.3mm) | Max finished hole size for blind & buried via is not greater than 0.2mm(corresponding drilling tool size is not greater than 0.3mm) |
| 21 | Min slot hole size is 0.5mm(corresponding drilling tool size is 0.6mm) | Min slot hole size is 0.5mm(corresponding drilling tool size is 0.6mm) |
| 22 | Min finished hole size for via pluged with solder mask is 0.3mm(corresponding drilling tool size is 0.4mm) | Min finished hole size for via pluged with solder mask is 0.3mm(corresponding drilling tool size is 0.4mm) |
| 23 | The scope of finished hole size for via-in-pad filled with resin is 0.1-0.4mm | The scope of finished hole size for via-in-pad filled with resin is 0.1-0.4mm |
| 24 | Max finished hole size for vias plated shut with copper is 0.15mm(corresponding drilling tool size is 0.25mm) | / |
| | 1/3 of half-hole(pth) | Min gap between hole wall and profile is 0.17mm | Min gap between hole wall and profile is 0.2mm |
| | half-hole(pth) | Min half-hole(pth) size is 0.5mm | Min half-hole(pth) size is 0.6mm |
| 25 | Laser drilling size | The scope of laser drilling size is 0.1-0.15mm | The scope of laser drilling size is 0.1-0.15mm |
| 26 | Aspect Ratio | 0.15mm(The board thickness is not greater than 1.0mm) | / |
| 27 | MAX aspect ratio for Hole plate is 10:1(The smallest drilling tool size is 0.2mm) | MAX aspect ratio for Hole plate is 8:1(Min drilling tool size is greater than 0.2mm) (If the min drilling tool size is 0.2mm, then the aspect ratio for Hole plate is 8:1) |
| 28 | Hole location tolerance | ±3mil | ±3mil |
| 29 | PTH tolerance | ±3mil | ±3mil |
| 30 | Pressfit holes tolerance | ±2mil | ±2mil |
| 31 | NPTH tolerance | ±2mil | ±2mil |
| 32 | The aspect ratio for hole filled with resin | MAX aspect ratio for Hole plate is 10:1.(The smallest drilling tool size is 0.2mm) | MAX aspect ratio for Hole plate is 8:1.(The smallest drilling tool size is 0.2mm) |
| 33 | Countersink angle tolerance | ±10° | ±10° |
| 34 | Countersink hole size tolerance | ±0.2mm | ±0.2mm |
| 35 | Countersink depth tolerance | ±0.2mm | ±0.2mm |
| 36 | Routing tolerance (edge to edge) | ±0.1mm | ±0.1mm |
| 37 | The tolerance for depth-control groove milling | ±0.2mm | / |
| 38 | Min tolerance for routing slot | ±0.127mm | ±0.15mm |
| 39 | Pad(ring) | Min Pad size for via hole | 14mil(8mil drillings,18/35UM base copper),20mil(8mil drillings,70UM base copper),24mil(8mil drillings,105UM base copper) | 20mil(8mil drillings,18/35UM base coppe),24mil(8mil drillings,70UM base copper),26mil(8mil drillings,105UM base copper) |
| | Min Pad size for component hole | 20mil(8mil drillings,18/35UM base copper),24mil(8mil drillings,70UM base copper),26mil(8mil drillings,105UM base copper) | 22mil(8mil drillings,18/35UM base copper),26mil(8mil drillings,70UM base copper),28mil(8mil drillings,105UM base copper) |
| 40 | Min BGA pad size | ENIG,Immersion Tin,Immersion Sliver,OSP:≥8mil | ENIG,Immersion Tin,Immersion Sliver,OSP:≥10mil |
| 41 | HASL:Independent track area≥8mil,Soldermask opening area for copper plane:≥14mil | HASL:Independent track area≥10mil,Soldermask opening area for copper plane:≥16mil |
| 42 | Pad size tolerance | .+/-1.5mil(pad size≤10mil);+/-10%(pad size>10mil) | .+/-1.5mil(pad size≤10mil);+/-10%(pad size>10mil) |
| 43 | Width/Space | Internal Layer(Substrate) | 1/3OZ,1/2OZ 3.5/3.5mil | 1/3OZ,1/2OZ 4/4mil |
| 44 | 1OZ 3/4mil | 1OZ 3/4mil |
| 45 | 2OZ 5/6mil | 2OZ 5/6mil |
| 46 | 3OZ 6/7mil | 3OZ 7/9mil |
| 47 | 4OZ 8/11mil | 4OZ 9/12mil |
| 48 | 5OZ 10/16mil | 5OZ / |
| 49 | External Layer(Substrate) | 1/3OZ 3.5/3.5mil | 1/3OZ 4/4.5mil |
| 50 | 1/2OZ 3.5/3.5mil | 1/2OZ 4/4.5mil |
| 51 | 1OZ 4.5/5mil | 1OZ 5/5.5mil |
| 52 | 2OZ 6/8mil | 2OZ 6.5/8mil |
| 53 | 3OZ 8/12mil | 3OZ 8/13mil |
| 54 | 4OZ 9/15mil | 4OZ 10/16mil |
| 55 | 5OZ 11/16mil | 5OZ 12/18mil |
| 56 | Width tolerance | ≤10mil:±1mil | ≤10mil:±1.5mil |
| 57 | >10mil:±1.5mil | >10mil:±2.0mil |
| 58 | Space | Min gap between hole wall and
conductor (None blind and buried via PCB) | 8mil(1 time laminating),9mil(2 time laminating),10mil(3 time laminating), | 9mil(1 time laminating),10mil(2 time laminating) |
| 59 | 6mil(<8L),7mil(8-12L),8mil(≥14L) | 7mil(<8L),8mil(8-12L),9mil(≥14L) |
| 60 | Min gap between profile and
design of inner layer | 8mil | 8mil |
| 61 | Min space of the V-scored does not reveal the copper(Central Line of V-scored to internal /external circuits, Red marking:the angle of V-scored H:the finished board thickness ) | H≤1.0mm:0.3mm(20°),0.33mm(30°),0.37mm(45°),0.42mm(60°) | H≤1.0mm:0.3mm(20°),0.33mm(30°),0.37mm(45°),0.42(60°) |
| 62 | 1.0<H≤1.6mm:0.36mm(20°),0.4mm(30°),0.5mm(45°),0.6mm(60°) | 1.0<H≤1.6mm:0.36mm(20°),0.4mm(30°),0.5mm(45°),0.6mm(60°) |
| 63 | 1.6<H≤2.4mm:0.42mm(20°),0.51mm(30°),0.64mm(45°),0.8mm(60°) | 1.6<H≤2.4mm:0.42mm(20°),0.51mm(30°),0.64mm(45°),0.8mm(60°) |
| 64 | 2.4<H≤3.0mm:0.47mm(20°),0.59mm(30°),0.77mm(45°),0.97mm(60°) | 2.4<H≤3.0mm:0.47mm(20°),0.59mm(30°),0.77mm(45°),0.97mm(60°) |
| 65 | Others | Min width of internal clearance | 8mil | 8mil |
| 66 | Min space of milling does not reveal the copper on the internal /external layer. | 8mil | 8mil |
| 67 | Min space of gold finger bevelling does not reveal the copper . | 8mil | 10mil |
| 68 | Min space bwteen hole walls in different net | 8mil | 10mil |
| 69 | Min gap between copper pads during ENIG | 4mil | 5mil |
| 70 | Min gap between gold fingers | 6mil | 7mil |
| 71 | Min gap between copper pads during HASL(Without soldermask bridges) | 6mil(At least the spacing of 10mil between copper pads in large copper plane) | 7mil(At least the spacing of 10mil between copper pads in large copper plane) |
| 72 | Min gap between peelable soldermask and copper pads | 14mil | 16mil |
| 73 | Min gap between silkscreen and copper pads | 6mil | 8mil |
| 74 | Min gap between carbon ink and copper pads | 10mil | 12mil |
| 75 | Min gap between carbon inks | 13mil | 16mil |
| 76 | Layer counts of metal-substrate PCB | 1-4L | ≥2L Need to be evaluated |
| 77 | Dimension tolerance of metal-substrate PCB(Include depth tolerance of depth-control groove
milling) | ±0.15mm | ±0.15mm |
| 78 | Partial surface treatment of metal-substrate PCB | HASL,Electroplated gold(Substrate thickness≤2OZ),ENIG,Immersion Tin,Immersion Sliver,OSP,Hard Gold,,ENEPIG | HASL,Electroplated gold(Substrate thickness≤2OZ),ENIG,Immersion Tin,Immersion Sliver,OSP,Hard Gold,,ENEPIG |
| 79 | Thermal conductivity | 1-4W/mK | 1-4W/mK |
| | Breakdown voltage | 500-5000V | 500-5000V |
| 80 | Metal material type | Metal-core,Mixed pressure of metal and FR4 | Metal-core,Mixed pressure of metal and FR4 |
| 81 | Min core of internal Layer | 0.13mm | 0.2mm |
| 82 | Layer counts | 1-30L | 1-30L |
| 83 | PCB thickness(Substrate) | HASL:0.6-3.2mm | HASL:0.6-3.2mm |
| 84 | Other surface treatment :0.2-6.0mm | Other surface treatment:0.2-6.0mm |
| 85 | Max finished size(H means board thickness) | HASL:350×300mm(0.4≤H<0.8mm),420×350mm(0.8mm≤H<1.2mm), | HASL:350×300mm(0.4≤H<0.8mm),420×350mm(0.8mm≤H<1.2mm), |
| 86 | (H>1.2mm):2L 550×1000mm;4L 550×900mm;6L and above 500×600mm | (H>1.2mm):2L 550×1000mm;4L 550×900mm;6L and above 500×600mm |
| 87 | Registration accuracy between layers | ≤5mil | ≤6mil |
| 88 | The finished board thickness tolerance (H means board thickness) | H≤1.0mm:±0.1mm | H≤1.0mm:±0.1mm |
| 89 | 1.0<H≤1.6mm:±8% | 1.0<H≤1.6mm:±8% |
| 90 | H>1.6mm:±10% | H>1.6mm:±10% |
| 91 | Impedance tolerance | ±5Ω(<50Ω),±10%(≥50Ω) | ±5Ω(<50Ω),±10%(≥50Ω) |
| 92 | Outline dimension tolerance | ±0.1mm | ±0.13mm |
| 93 | Outline position tolerance | ±0.1mm | ±0.1mm |
| 94 | Min bow&twist | Blind/Buried hole board or dissymmetrical laminated construction:1.0% | Blind/Buried hole board or dissymmetrical laminated construction:1.0% |
| | Normal:0.75% | Normal:0.75% |
| 95 | The thickest copper of inner layer | 4OZ | 3OZ |
| 96 | The thinnest insulating layer | 3.5mil(HOZ base copper) | 4mil(HOZ base copper) |
| 97 | Min width and height of silkscreen | Width 5mil,height 25mil(1/3,1/2OZ base copper); Width 6mil,height 32mil(1/1OZ base copper); Width 7mil,height 45mil(2/2OZ base copper) | Width 5mil,height 25mil(1/3,1/2OZ base copper); Width 6mil,height 32mil(1/1OZ base copper); Width 7mil,height 45mil(2/2OZ base copper) |
| 98 | Min radius of the inner corner | 0.4mm | 0.4mm |
| 99 | V-CUT angle tolerance | ±5° | ±5° |
| 100 | V-CUT symmetrical tolerance | ±0.1mm | ±0.1mm |
| 101 | The remain thickness tolerance of V-CUT | ±0.1mm | ±0.1mm |
| 102 | Routing | Milling,V-CUT,Bridge connection,Stamp holes,Punching | Milling,V-CUT,Bridge connection,Stamp holes,Punching |
| 103 | Min width of soldermask bridge | Finished copper≤1OZ:4mil(Green),5mil(Other color) | Finished copper≤1OZ:4mil(Green),5mil(Other color) |
| 104 | Finished copper2-4OZ:8mil | Finished copper2-4OZ:8mil |
| 105 | Min width of soldermask cover track | 2.0mil | 2.5mil |
| 106 | Soldermask color | Green matte/glossy, Yellow,Black matte/glossy,Blue matte/glossy ,Red,White | Green matte/glossy, Yellow,Black matte/glossy,Blue matte/glossy ,Red,White |
| 107 | Silkscreen color | White,Yellow,Black,Gray,Orange | White,Yellow,Black,Gray,Orange |
| 108 | Gold finger bevelling tolerance | ±5° | ±5° |
| 109 | The remain thickness tolerance of the gold finger bevelling | ±0.13mm | ±0.13mm |
