Системная плата для печатных плат и PCB (BLISSPCB0001)

1. RoHS
2. No MOQ
3. 1-Multilayer Board
4. Rigid Flex PCB board
5. PCB design & PCB Assembly

Technical requirements:
Material: FPC
Layer: 8 layer
Board Thickness: 1.60mm
Copper thickness: 1oZ
Solder mask: Green
Min. Hole size: 0.30mm
Min. Line width/space: 0.1mm/0.1mm
Surface Finishinge: Immersion Ni/Au

Reference - Our production capability for rigid PCB:
1)Layer Count: 1-36
2)Max panel size: 20"*32"
3)Min. Finished board thickness: 0.20mm
4)Max. Finished board thickness(1L-2L): 3.2mm
5)Max. Finished board thickness(multilayer): 6.0mm
6)Min. Core thickness: 0.1mm
7)Min. Mechanical drill size: 0.20mm
8)Laser drilling: 0.08-0.15mm
9)Min. Line width/space: 3/3mil
10)Soldermask plug Via: 1.0mm(max)
11)Min. Solder dam width: 3.5mil
12)Space for mask between PAD: 8mil
13)Impedance control: +/-10%
14)Max. Copper thickness(inner): 5oZ
15)Max. Copper thickness(outer): 6oZ
16)Warp&twist: 0.50%
17)Special Via: Blind via, Buried via, etc.
18)Surface Finishing: HASL

Lead Free HASL
OSP
Flash Gold [Max Gold thickness: 15u"]
Immersion Ni/Au [Max Gold thickness: 12u"]
Immersion Silver
Immersion Tin
Peelable Sold Mask
Carbon Ink
Gold Finger [Max Gold thickness: 50u"]
Thick Gold [Max Gold thickness: 80u"]